发明名称 |
POLYARYLENE SULFIDE RESIN COMPOSITION FOR SEALING ELECTRONIC PART AND ELECTRONIC PART SEALED THEREWITH |
摘要 |
PURPOSE:To prepare the title compsn. which gives an electronic part having an enhanced reliability without corroding or discoloring an element or lead of the part by compounding a specific polyarylene sulfide with a zinc carbonate powder. CONSTITUTION:A polyarylene sulfide having a melt flow rate of 1000 g/10 min or higher is compounded with a zinc carbonate powder having a particle size of 0.1 mum or lower to give the title compsn., which generater a reduced amt. of metal-corroding gas, giving an electronic part having an enhanced reliability without corroding or discoloring an element or lead of the part. |
申请公布号 |
JPH0476056(A) |
申请公布日期 |
1992.03.10 |
申请号 |
JP19900189313 |
申请日期 |
1990.07.19 |
申请人 |
DAINIPPON INK & CHEM INC |
发明人 |
IZUTSU HITOSHI;YAMAGUCHI TOSHIHIDE |
分类号 |
C08K3/26;C08L81/02;H01C1/02;H01L23/29;H01L23/31;H03H9/02 |
主分类号 |
C08K3/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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