发明名称 POLYARYLENE SULFIDE RESIN COMPOSITION FOR SEALING ELECTRONIC PART AND ELECTRONIC PART SEALED THEREWITH
摘要 PURPOSE:To prepare the title compsn. which gives an electronic part having an enhanced reliability without corroding or discoloring an element or lead of the part by compounding a specific polyarylene sulfide with a zinc carbonate powder. CONSTITUTION:A polyarylene sulfide having a melt flow rate of 1000 g/10 min or higher is compounded with a zinc carbonate powder having a particle size of 0.1 mum or lower to give the title compsn., which generater a reduced amt. of metal-corroding gas, giving an electronic part having an enhanced reliability without corroding or discoloring an element or lead of the part.
申请公布号 JPH0476056(A) 申请公布日期 1992.03.10
申请号 JP19900189313 申请日期 1990.07.19
申请人 DAINIPPON INK & CHEM INC 发明人 IZUTSU HITOSHI;YAMAGUCHI TOSHIHIDE
分类号 C08K3/26;C08L81/02;H01C1/02;H01L23/29;H01L23/31;H03H9/02 主分类号 C08K3/26
代理机构 代理人
主权项
地址