发明名称 PLATING METHOD OF LEAD TRERMINAL
摘要 PURPOSE:To simply form a solder-plated part even after a lead terminal has been welded to the case of a component main body by a method wherein, after a mounting-leg part has been coated with a flux composed mainly of phosphoric acid, it is immersed in a solder tank and a solder plating operation is executed to the mounting-leg part. CONSTITUTION:A lead terminal 1 is made of stainless steel. A wide belt-sheet part is a welding part 1a to the electrode face of the stainless steel case 2 for an electric double layer capacitor C. A narrow rod-shaped part which is connected and installed at its lower part is a mounting leg 1b to a circuit board which is not shown in the figure. When a solder plating operation is executed to the mounting leg 1b, the range indicated by slanted lines in the figure is coated with a flux composed mainly of phosphoric acid, and the part is immersed in a solder tank. Thereby, a solder-plated part is formed on the mounting leg 1b.
申请公布号 JPH0475314(A) 申请公布日期 1992.03.10
申请号 JP19900189793 申请日期 1990.07.18
申请人 ELNA CO LTD;ASAHI GLASS CO LTD 发明人 KIMURA YOSHIKATSU;SATO TATSUYA;KURIHARA KANAME;OKUBO SATORU;JINBO TOSHIICHI
分类号 C25D7/00;H01G13/00 主分类号 C25D7/00
代理机构 代理人
主权项
地址