| 发明名称 |
DIAMOND COMPOSITE HEAT SINK FOR USE WITH SEMICONDUCTOR DEVICES |
| 摘要 |
A composite comprised of diamond particles embedded in a metal matrix is a highly satisfactory heat sink material for use with a semiconductor. |
| 申请公布号 |
CA1297208(C) |
申请公布日期 |
1992.03.10 |
| 申请号 |
CA19890615077 |
申请日期 |
1989.09.29 |
| 申请人 |
AMOCO CORPORATION |
发明人 |
BURNHAM, ROBERT D.;SUSSMANN, RICARDO S. |
| 分类号 |
C22C26/00;H01L23/373 |
主分类号 |
C22C26/00 |
| 代理机构 |
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