| 摘要 |
The method comprises the steps of forming a conductor (2), an undoped conductor (3), a nonconductor (4) with uneven surface and a conductor (5) on a substrate (1) sequently, coating a photoresist (6) onto the conductor and nonconductor layers (5,4) to form a first window of the photoresist on the bent portion of the nonconductor (4), etching the exposed nonconductor portion to remove the photoresist (6), coating a second photo resist (11) thereon forming a second window on the etched portion, applying a metal (12) on the whole surface of substrate and removing the second photoresist (11), thereby connecting the metal layer to other portions.
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