发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To reduce a weight and to improve maintainability by providing a ring groove of a predetermined shape on a pin of a multipolar connector, molding a shape memory alloy in a predetermined shape at a position corresponding to the groove at the engaging part of the connector at the side of a board to be engaged, and securing by the engagement of both the connectors. CONSTITUTION:An electronic module is secured by engagement of a multipolar connector. A ring groove of a predetermined sectional shape is provided at a male pin 19 of a multipolar connector 6 of the module side, and an element 21 molded from shape memory alloy 21 in a predetermined shape is engaged at a position corresponding to the groove at a female pin 20 of a multipolar connector 7 of a board side. Accordingly, since the partial collar of the alloy 21 is so deformed as to be warped inward due to temperature rise caused by heat generated from the module 1 during the use of an electronic device, the pin 19 is not removed, the module 1 is not removed.
申请公布号 JPH0474493(A) 申请公布日期 1992.03.09
申请号 JP19900188411 申请日期 1990.07.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 FURUYA SEIICHIRO
分类号 H01R24/00;H05K7/14;H05K7/20 主分类号 H01R24/00
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