| 摘要 |
PURPOSE:To perform sufficient washing with water in a short time without contamination of the surface of a wafer with dust, by completely immersing the wafer into cleaning water, and overflowing part of the cleaning water under a condition that the wafer surface is not in contact with the water surface. CONSTITUTION:A wafer 1 is held with a substrate carrier 2. The wafer 1 is put in a washing bath 3 filled with cleaning water. At the same time, a drain valve 5 is opened, and the water in the washing bath 3 is drained through a draining port 7. Water, whose amount is larger than the amount of the drained water, is supplied from a water feeding port 6. Since the amount of the supplied water is larger than the amount of the drained water, the excessive water overflows the edge of the washing bath 3 and flows into an overflow receiver 8 together with dust floating on the surface of the water. The bottom of the washing bath is inclined so that the water drained from the washing bath 3 flows without stagnation. For this purpose, a punching plate 4 is provided as a carrier receiver so that the carrier 2 is placed on it.
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