摘要 |
PURPOSE:To screen light form a gap between adjacent LED array chips, facilitate a production, and arrange light emitting elements at a uniform pitch by a method wherein the LED array chip is mounted with a light emitting part opposed to a light-transmitting part of a mounting substrate, and a light screening body for screening light from a gap between the adjacent LED array chips, which is to transmit through the light-transmitting part of the mounting substrate, is provided on the mounting substrate. CONSTITUTION:In a mounting substrate 22, a bundle of fiber 23 for transmitting the light of a light emitting part 5 of each LED array chip 4 is embedded in a light-transmitting part. A conductor pattern 24 connected through solder bumps 27 is previously disposed opposedly to conductive electrodes 8 of each chip 4. A light screening body 25 for screening light from a gap 14 between the chips 4 is formed so as to cover the gap 14. By mounting the chips 4 with the light emitting part 5 opposed to the mounting substrate, the light emitting parts 5 of all the chips 4 can be disposed to be flush with each other regardless of a production error of the chips in height. Furthermore, a pitch between the chips 4 can be uniformized. Light form the gap 14 between chips 4 can be positively screened by the light screen body 25. |