| 摘要 |
PURPOSE:To contrive to improve developing uniformity and throughput by a method of constructing so that a developing solution may be overflowed from a lower position than a substrate surface. CONSTITUTION:A spin chuck 3 is relatively moved upwardly with respect to a chuck ring 4 and a nozzle ring 5 to load a semiconductor wafer 2 thereon. Thereafter, the spin chuck 3 is moved downwardly to transfer the semiconductor wafer 2 onto the chuck ring 4 and a developing solution is supplied from a developing solution supplying piping 6. The developing solution passes through flowing path 5a, flows from a nozzle 5b into a liquid storing mechanism 5c, pours out so as to overflow, and once stored inside a ring-form groove 8 at a lower than a surface of the wafer 2. The solution is supplied to the surface of the semiconductor wafer 2 so as to overflow to be stored inside a container- form recessed part of the nozzle ring 5. The high-pressurized developing solution does not directly come into contact with the surface of the semiconductor wafer 2, striped developing unevenness does not occur, and the developing solution can be supplied onto the entire surface in a short time. |
