| 摘要 |
PURPOSE:To obtain a printed-wiring board having high speed performance by a method wherein GND layers are connected to one another through holes for inter-layer connection use aiming at the connection between the GND layers in addition to the connection between the GND layers through holes for component mounting use and the connection between the GND layers through relay through holes for signal connection use. CONSTITUTION:Through holes 2 for component mounting use are provided in a printed-wiring board 1 and through holes 3 for inter-GND layer connection use are provided in free areas. This board 1 is provided with GND layers 4, which are adjacent to signal patterns 6, and the GND layers 4 are connected to one another through the holes 3. Thereby, a printed-wiring board, which is capable of fulfilling sufficiently the efficiency of a high-speed device and is good in AC characteristics, can be obtained. |
