| 摘要 |
PURPOSE:To uniformly and quickly spread adhesive agent on semiconductor pellets different in size, by setting the area of contact surface with the rear of a semiconductor pellet so as to be larger than the semiconductor pellet, in an adhesive agent coater. CONSTITUTION:The surface 8a of an impregnation body 8 of an adhesive agent coater 3 is formed in a spherical shape having a constant curvature. An adhesive agent transfer layer 9 for uniformly forming an adhesive agent layer 10 is installed on the surface 8a. A semiconductor pellet 1 which has been conveyed above the adhesive agent transfer layer 9 is vertically conveyed downward, in order that adhesive agent may be transferred on the rear 1a of the pellet 1, and the adhesive agent is transferred. When the area of the semiconductor pellet 1 is comparatively large, the pellet is vertically moved downward with a constant loard, until the adhesive agent is transferred on the whole rear of the pellet. Then the adhesive agent transfer layer 9 composed of flexible material is deformed by the load at the time of descending of the pellet. That is, the adhesive agent on the transfer part can uniformly come into contact with the rear of the semiconductor pellet, and very uniform transfer can be realized.
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