发明名称 MULTILAYER WIRING BOARD
摘要 PURPOSE:To electrically connect circuit layers with each other by simple method in place of through hole plating, etc., by electrically connecting the specified circuit layers with each other by a screw, which has a conductive part at the surface, in a multilayer wiring board where circuit patterns are made. CONSTITUTION:This figure shows the condition that a screw 4 is screwed in the hole provided in a multilayer circuit board, that the solder at the surface of screw 4 is fused, and that the specified circuits are connected electrically with each other by the screw 4. This has surface circuits 1a and 1b, and as inner circuit layers, two layers 2a and 2b exist being insulated by an insulating layer 3. In the circuit layers 2a and 2b, 21 is a circuit part. The screw 4 has the conductive part 5 by solder at the surface, and by this screw the circuit layers 1a, 2a, and 1b electrically connect with each other. The screw 4 is fixed by the nut 6 at the bottom.
申请公布号 JPH0468597(A) 申请公布日期 1992.03.04
申请号 JP19900180615 申请日期 1990.07.10
申请人 SUMITOMO BAKELITE CO LTD 发明人 IKETANI KUNIO
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址