Exterior leads forming device for semiconductor devices

摘要

The forming device for semiconductor devices 1 includes a pair of roller holders 40 rotatably attached to a punch plate 4. When the punch plate 4 is lowered, the semiconductor device 1 is fixedly held on a bending die 3 by means of a pressing plate 8, and roller holders 40 are guided via guide plates 60, such that bending rollers 7 bend the exterior leads 1a along the sides of the bending die 3. The orbits of the bending rollers 7 are monitored by cameras (two-dimensional imaging devices) 70, and orbit errors, calculated by comparator means 80, are fed back to motor control circuits 90, to adjust the positions of the guide plates 60 by means of motors 64.