| 摘要 |
PURPOSE:To make it possible to position accurately a relay conductor by a method wherein a semiconductor device is manufactured into a constitution, wherein a chip has a plurality of pads, a lead frame has a stage in its central part and has inner and outer leads on its peripheral part and a terminal performs relay of a wire bonding between the pads and the inner leads and is provided between the chip and the inner leads. CONSTITUTION:An upper surface recessed part 33, in which a stage 21 of a lead frame 2 is accurately fitted, is shaped in the central part of a base material 31 of a terminal 3 at the stage of a green sheet, NiCr/Au adhered on the peripheral part of the upper surface of the base material 31 by sputtering, for example, is patterned by a photolithography technique and moreover, an electroless Au plating is applied and a relay conductor 32 is provided. When the terminal 3 manufactured in such a way is fitted in the lead frame from the lower part of the stage 21 with a chip mounted thereon and is firmly bonded with a bonding agent, the conductor 32, which is provided between the chip 1 and inner leads 22, of the terminal 3 can be positioned with a prescribed accuracy. After that, a wire bonding is executed using wires 4. |
