SOLDERING INTERCONNECT METHOD FOR SEMICONDUCTOR PACKAGES

摘要

A method and apparatus for attaching the outer leads of a semiconductor package (preferably a Tape Automated Bonded circuit) to the traces on a printed circuit board is described. The outer leads of the package are configured in an angled orientation so that the tip of each lead extends downwardly below the lower surface of the package. As a result, placement of the package against the circuit board causes the leads to be biased downwardly against the traces. In order to accomplish this, the package is secured to the board using a rigid frame structure. The frame structure urges the edges of the package against the board. This insures that the leads make electrical contact with the traces in a fast and efficient manner, while avoiding problems associated with a lack of lead coplanarity.