| 摘要 |
<p>PURPOSE:To enable a soldering operation to be stably and easily carried out by a method wherein a round hole or recess is provided to the tip of a lead pin. CONSTITUTION:A pattern paper where soldering parts are cut out is placed on a printed board which is to be mounted with a package, and eutectic solder (solder paste) is applied thereon. After the eutectic solder is applied, the excessive solder is scraped off with a knife so as to prevent solder from being excessively applied. When a package is mounted on a part where solder has been applied, solder penetrates into a hole 6 or a recess 7 provided to a package lead pin. The package mounted on the printed board is heated in a hot tank, and then the package is soldered to the printed board with solder molten by heating. At this point, eutectic solder in the hole 4 of the lead pin 4 or solder paste attached to the recess of the lead pin 4 is fused at the same time, sucked up to the upper part of the lead pin 4 by the action of a surface tension, and fused into the solder plating of the lead pin subjected to a surface treatment to stably solder the lead pin 4.</p> |
