发明名称 PREPARATION OF LAMINATE BOARD FOR PRINTED CIRCUIT
摘要 PURPOSE:To enable a low-pressure molding under a normal pressure and prepare the title board free from void by deaerating a prepreg under specified conditions in preparing the board comprising a specific surface layer and a specific intermediate layer. CONSTITUTION:In preparing a laminate board comprising a surface layer consisting of a woven glass fabric impregnated with a thermoset resin (e.g. an epoxy resin) and an intermediate layer consisting of a nonwoven glass fabric impregnated with a thermoset resin contg. 10-200wt.% inorg. filler (e.g. silica and Al2O3.3H2O), a prepreg used for preparing the board is deaerated in vacuo before thermal press molding.
申请公布号 JPH0468034(A) 申请公布日期 1992.03.03
申请号 JP19900180614 申请日期 1990.07.10
申请人 SUMITOMO BAKELITE CO LTD 发明人 KONAGAYA HIROSHI
分类号 C08J5/24;B29C43/20;B29C43/32;B29K105/06;B29L31/34;H05K1/03 主分类号 C08J5/24
代理机构 代理人
主权项
地址
您可能感兴趣的专利