METHOD FOR PACKAGING SEMICONDUCTOR DEVICE,申请号US19910644566-传众专利搜索

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发明名称	METHOD FOR PACKAGING SEMICONDUCTOR DEVICE
摘要
申请公布号	US5092033(A)	申请公布日期	1992.03.03
申请号	US19910644566	申请日期	1991.01.23
申请人	SUMITOMO ELECTRIC INDUSTRIES, LTD.	发明人	NISHIGUCHI, MASANORI;MIKI, ATSUSHI
分类号	H01L21/00;H01L21/60;H01L21/68;H05K1/02;H05K3/30	主分类号	H01L21/00
代理机构		代理人
主权项
地址

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