| 摘要 |
<p>PURPOSE:To protect a sealing glass against cracks by a method wherein a semiconductor chip is die-bonded to a lead frame, the pads of the chip are connected to the leads of the lead frame with bonding wires, the leads are pinched between a ceramic board and a ceramic cap, the semiconductor chip is sealed up with the sealing glass, and suspension pins and the leads are cut off from the lead frame. CONSTITUTION:A semiconductor chip is die-bonded to an island 1-a, the pads of the semiconductor chip are connected to leads with bonding wires, and four corners of a frame are cut off. At this point, the branches of suspension pins are left unremoved as they are connected to the residual frame. Then, the leads are formed by a punch 5 of a lead forming die 4, the leads are pinched between a ceramic board 6 and a ceramic cap 7, they are sealed up with a sealing glass 8, and the suspension pins and the leads are cut off from the frame. By this setup, a sealing glass is protected against cracks caused by a mechanical stress at the forming of leads.</p> |
