| 摘要 |
PURPOSE:To obtain an epoxy resin composition improved in adhesiveness between copper foil and resin at high temperatures, flexibility, bending strength, etc., by mixing a bisphenol A epoxy resin with a specified curing agent, an additive comprising a high-molecular-weight polyhydroxy polyether. CONSTITUTION:A resin base (a) comprising a bisphenol A epoxy resin of the formula (wherein (n) is 0-10; R<1> and R<2> are each glycidyl; and A<1> to A<8> are each H or Br) is mixed with an epoxy resin curing agent (b) comprising a bisphenol A or its bromide (i) of the formula (wherein (n) is 0; R<1> and R<2> are each H; and A<1> to A<4> are each H or Br) or a bisphenol A or its bromide (ii) of the formula derived by bonding at least two molecules of component (i) through a methylene group in any position of A<1> to A<4> and an additive (c) comprising a high-molecular-weight polyhydroxy ether of the formula (wherein (n) is 10-1,000; R<1> and R<2> are each (hydroxy)alkyl; and A<1> to A<8> are each H or Br).
|
