| 摘要 |
PURPOSE:To improve a repair device in processing performance by a method wherein processing laser systems provided with a laser processing source and a mechanism which automatically controls a processing interval are provided to carry out a fuse fusing processing to semiconductor chips provided with redundant circuits arranged in parallel on a semiconductor wafer. CONSTITUTION:Two laser oscillators 1a and 1b or more are mounted, and the output laser beams of them are set to be separate from each other by a certain interval correspondent to the size of a chip through a processing interval controlling mechanism 2 composed of mirrors 3a, 3b, and 3c. Processing can be carried out in two rows such as processing sequences A and B at the same time, and furthermore chips can be processed in parallel at the same time. The processing interval controlling mechanism 2 sets an interval between processing laser beams in such a manner that mirrors are moved by a pulse motor or the like figuring a processing interval between the chips, monitoring the size of the chip on a wafer 5. |
