| 摘要 |
PURPOSE:To offer a copper alloy good in strength and elongation properties, excellent in the adhesion of solder and having <= 10% IACS electric conductivity by incorporating specified amounts of Ni, Sn, Zn, Mg and Cr into copper. CONSTITUTION:This copper alloy is constituted of, by weight, 5.0 to 15.0% Ni, 1.0 to 5.0% Sn, 5.0 to 25.0% Zn, 0.001 to 0.05% Mg, 0.001 to 0.1% Cr and the balance Cu. Ni and Sn improve the strength and elongation properties and deteriorate the electric conductivity, but in the case of less than the lower limit, the above effects are sufficient, and also in the case of more than the upper limit, the effects are saturated. Zn improves the adhesion of solder and deteriorates the electric conductivity, but in the case of less than the lower limit, the above effects are insufficient, and in the case of more than the upper limit, the hot workability is deteriorated. Mg improves the hot workability, but in the case of less than the lower limit, the above effect is low, and in the case of more than the upper limit, the fluidity of the molten metal is deteriorated. Cr reinforces the boundaries of the ingot and increases the hot workability, but in the case of less than the lower limit, the above effects are low, and in the case of more than the upper limit, the molten metal is oxidized and the castability is deteriorated. |
