METHOD OF MAKING PRINTED CIRCUIT BOARD ASSEMBLY

摘要

A first set of plated-through holes in the printed circuit board (PCB) are covered by a protective solder mask on the solder side of the PCB while a second set of plated-through holes are exposed. Electrical components are disposed on the component side with leads inserted in the second set of holes. Solder is prevented from flowing into the first set of holes during wave soldering by the mask covering. Conductive pins designed for press fitting into the first set of holes are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.