| 摘要 |
PURPOSE:To prevent a short circuit from occurring between a bonding wire and a suspension lead located at a corner by a method wherein the suspension lead is covered with insulator. CONSTITUTION:A lead frame is provided with suspensions 2a and 2b at its corners, and a metal surface is exposed at the suspension lead 2a. Then, all the surface of the suspension lead 2b is covered with an insulator such as an insulating tape or a resin coating. By this setup, even if a bonding wire 3 adjacent to the suspension lead 2b is made to sag or deformed at molding to come into contact with the suspension lead 2b, a semiconductor device can be protected against characteristic failure caused by short circuits. |
