| 摘要 |
PURPOSE:To realize the small sized and inexpensive device by arranging each electrode and each pad of a surface acoustic wave element opposite to each other and connecting them electrically so as to attain leadout from the surface acoustic wave element without adoption of wire bonding. CONSTITUTION:A base 48 has a recessed part in which a surface acoustic wave element 46 is contained and an input pad 50, an output pad 52 and an earth pad 54 are adhered to the recessed part. A gold pad 58 is placed to the surface of the pads 50, 52, 54 opposite to electrodes of the surface acoustic wave element 46 and the electrode of the element 46 and the gold pad 58 are connected by means of pressing or heating or the like. Thus, no wire bonding is required and the small sized and inexpensive device is realized. |
