| 摘要 |
PURPOSE:To manufacture a printed board remarkably favorable in development stability by applying rust preventives on the printed board immediately after plating finish or after lamination, prior to electrodeposit photosensitive resin, so as to prevent the corrosion or oxidation of copper. CONSTITUTION:When applying rust preventive treatment to a printed wiring board before electrodepositing photosensitive resin, an electrodeposition bath, to which deionized water is added using the compound shown by the specified formula as the rust preventives, is prepared. Next, a copper board, whose through hole is plated with copper inside, is dipped in imidazole aqueous solution, and after pull up, it is dried. With this copper substrate, to which rust preventive treatment is applied, as an anode, slow start is performed in electrodeposition bath, and then a specified current is applied. Next, the coating obtained by washing and drying this coating comes to the favorable finish. And by performing treatments such as exposure, development, etc., for those photosensitive resist films, pattern circuits can be obtained, and in the wiring board, where the copper board to which rust preventive treatments is applied is electrodeposited, there is no pinhole at all, and the formation of through holes is complete. |
