| 摘要 |
PURPOSE:To make practical, industrial production of LED print heads feasible by a method wherein the LED print head includes a side-face light emission type ultra high density LED array chip, and self-alignment method is employed for connecting electrodes on the LED array chip to wiring electrodes. CONSTITUTION:On a glass substrate 2, conductor lines of the specified number are previously drawn in a space spreading from a chip 1 side toward the other side so as to form a wiring pattern of leader electrodes 4. Only a side-face light emitting type ultra-high density LED array chip 1 is mounted on a side of the glass substrate 2. When the LED array chip 1 is mounted, electrodes 8 of individual dots on the LED array chip 1 are connected to the lead electrode 4 on the glass substrate 2 by means of self-alignment method based on the surface tension of solder. Then, driver ICs 3 are mounted on the other side of the glass substrate 2 and connected by the lead electrodes 4 and bonding wires 5. The light emitted from the LED array chip 1 is magnified by passing through a lens 6, and projected on a sensitized drum 7. |
