| 摘要 |
PURPOSE:To prevent generation of short-circuit between wiring patterns when upside down mounting of a jumper chip is carried out by forming an insulation resin layer where no solder is stuck on tin or solder plated layer. CONSTITUTION:For example a substrate metal layer 3 comprising electroless nickel plated layer and the like is formed from the surface 2a to the rear 2b of insulative substrate 2 composed of alumina ceramic and the like. On the surface of the layer 3 tin or solder plated layer 4 is formed. Furthermore on the surface 2a except the edges of insulative resin layer 5 of silicon resin, epoxy resin and the like. With the arrangement, generation of short-circuit between wiring pattern 7, 8 is prevented by the layer 5 even when a jamper chip is mounted under upside down conditions. |
