| 摘要 |
PURPOSE:To automatically form a high density solder bump without communication among pumps utilizing a solder ball smaller than that of a conventional one by depositing a solder flux on a pad by a transfer process using a pin. CONSTITUTION:A transparent hole 31 in which a solder ball 8 is fitted is provided in a mask 28 comprising a metal plate such as stainless thinner than the diameter of the solder ball 8. A mesh plate 29 comprising a stainless wire and the like has the number of meshes where a plurality of meshes exposed to the inside of the transparent hole 31, say 250 meshes, and on the surroundings of the mesh plate there is deposited a blinder coating material such as an emulsion 34. Further, there provided is an air suction hole 32 opposing to the transparent hole 31 putting it between the hole and the mesh plate 29. Accordingly, provided a vacuum device connected to an air suction socket 33 is driven to reduce the pressure in a vacuum chamber 27, the solder ball 8 fitted to the transparent hole 31 is maintained in the transparent hole 31 by suction force passing through the mesh plate 29 and the air intake hole 32, and the solder ball is separated down from the transparent hole 31 by stopping the vacuum device and vibrating it. |
