发明名称 |
ULTRA HIGH DENSITY INTEGRATED CIRCUIT PACKAGES, METHOD AND APPARATUS |
摘要 |
An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided. |
申请公布号 |
AU8519891(A) |
申请公布日期 |
1992.03.02 |
申请号 |
AU19910085198 |
申请日期 |
1991.08.01 |
申请人 |
STAKTEK CORPORATION |
发明人 |
NAME NOT GIVEN |
分类号 |
H01L21/56;H01L23/00;H01L23/433;H01L25/10;H05K7/02;H05K7/20 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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