| 摘要 |
PURPOSE:To expose a wiring efficiently by forming a wiring layer for wiring and connecting the chips of an integrated circuit and a wiring layer for wiring in the chips in common. CONSTITUTION:When a chip 1 is irradiated with light, a section 50 in 11 is brought to the shade of a photo-mask, and light is applied only to a section 60. Consequently, light is applied to a section 61, and a section 51 is brought to the shade. No light is applied to the outside of an irradiation range 11, the right side from a longitudinal solid line, naturally at that time. When a chip 2 is irradiated with light, the section 50 in 12 is also brought to the shade of the photo-mask and light is also applied only to the section 60, but light is also applied to the section 61 and the section 51 is also brought to the shade at that time. When the whole is developed, a photo-resist remains to the section 50 including 51, and finally the metallic film of wiring is left in the section 50 including 51. |
