发明名称 RESIN SEALING FORMING DEVICE FOR ELECTRONIC PARTS AND JIG FOR FORCED EJECTOR PIN
摘要 PURPOSE:To surely prevent strain and curving deformation of a metal mold component due to mold fastening force by making fixed type ejector mechanism equipment members and movable ejector mechanism equipment members to be connected and supported on the almost whole surfaces thereof. CONSTITUTION:An ejector frame 324 is fitted into a groove 328 in the vertical direction formed on an ejector mechanism equipment member 33 and the ejector frame is provided so that, when it is arranged to be connected to the upper faces of the respective ejector pins (321, 322) to push down the frame and to simultaneously push down respective pins. Accordingly, the ejector mechanism equipment 33 can be almost all over connected to the rear (upper surface) of the upper mold 35 excepting the part of the through hole part 327. Further, also the lower part ejector mechanism 37 to be provided on the movable board 36 side is about the same with the upper part ejector mechanism 32 in the basic constitution. Thereby, strain, curving deformation of the metal mold component of both molds or the like. due to mold fastening force can surely be prevented.
申请公布号 JPH0463443(A) 申请公布日期 1992.02.28
申请号 JP19900176081 申请日期 1990.07.02
申请人 TOOWA KK 发明人 OSADA MICHIO
分类号 H01L21/56;B29C45/02;B29L31/34 主分类号 H01L21/56
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