| 摘要 |
A circuit board assembly is provided having at least one integrated circuit package E mounted on a circuit board A either directly or via a socket G, G'. An air gap is present between the integrated circuit package and the surface of the circuit board and accommodates a heat shunt H which is connected thermally to the base of the integrated circuit package and to the surface of the printed circuit board. Heat from the integrated circuit package is conducted through the heat shunt to the circuit board and is dispersed via the power planes in the circuit board. Thermal vias I, which may be plated through holes, may be provided through the board directly beneath the heat shunt to increase thermal conduction away from the integrated circuit package. <IMAGE> |
