| 发明名称 |
METHOD OF PRODUCING MICROBUMP CIRCUITS FOR FLIP CHIP MOUNTING |
| 摘要 |
In a microbump flip-chip mounting method, microcircuit features such as conductors and microbumps are formed by a lift off process. A first refractory metal is employed to promote adhesion between a layer of aluminum deposited by physical vapor deposition and a second refractory metal is employed to promote adhesion between the aluminum and an overlying layer of gold.
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| 申请公布号 |
US5118584(A) |
申请公布日期 |
1992.06.02 |
| 申请号 |
US19900531736 |
申请日期 |
1990.06.01 |
| 申请人 |
EASTMAN KODAK COMPANY |
发明人 |
EVANS, MARK D.;DEBESIS, JOHN R.;BACON, WESLEY H. |
| 分类号 |
H01L21/60;H01L21/3205;H01L21/48;H01L23/498;H01L33/00;H05K3/02;H05K3/14 |
主分类号 |
H01L21/60 |
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