| 摘要 |
PURPOSE:To obtain a wiring lead frame which is free from a deformation, superior in mechanical strength and has insulation on both the surfaces, by a method wherein the lead frame is held firmly with little deformation by the first resin molding part and the second resin layer is formed of injection molding resin superior in mechanical strength. CONSTITUTION:At least one surface of a lead frame 1 is fixed by the first resin 2 so that the same sits astride of a plurality of wiring patterns. Then the second resin 3 is molded in a gap part to be obtained by separating an upper and lower movable cores 8, 9 each by a fixed interval from each other and insulating coating of both the surfaces is performed. Furthermore, a stationary pin 6 and ejector pin 7 are pushed against a terminal part of wiring of the lead frame, which is prevented from sticking of the first and second resin 2, 3. Furthermore, its pressure at the time of molding is weakened by making use of a thermosetting resin material as the first resin 2, the wiring pattern of the lead frame 1 is stuck by preventing a deformation of the same and then both the surfaces of the lead frame is insulated firmly by making use of a thermoplastic resin material for the second resin 3. |
