| 摘要 |
PURPOSE:To collectively perform bonding of a chip and in-and-output teminals by providing a first insulating layer laminated all over a metal substrate, a second insulating layer formed in the cental part of the first insulating layer and the terminals formed of a solder layer laminated on the part having the exposed lead tip parts. CONSTITUTION:A second insulating layer 4 is formed having a central part of an insulating layer 2 as a center. In this insulating layer 4, a space, where a semiconductor is to be mounted, and also the terminals of the leads 3 formed on this central part are coated. Next, in order to form solder layers near the terminals of these leads, contact holes are formed on the second insulating layer 4 to expose the lead terminals, and when the lead terminals are exposed, solder layers 5 are applied inside the contact holes to finish the terminals. Thereby, a wire bonding process of separate bonding disappears to come to collective bonding thus to enable a multiterminal semiconductor device to be efficiently manufactured. |
