| 摘要 |
PURPOSE:To activate the surface of polyimido and enhance throughput by carrying out plasma processing which provides a functional group which does not cause cohesive failure on the surface of polyimido and moreover contributes to the improvement in adhesion. CONSTITUTION:The surface of a polyimido film 3 with copper wires 1 and 2 is plasma-processed with a mixed gas of O2 and CF4, thereby forming a chemically codified polyimido surface 4. A film adhesive 7 is inserted between the other polyimido film 5 processed in a similar manner and the polyimido film 4 where in the film adhesive 7 is provided with a conductor comprising a chemical compound of gold and tin based on polyimido. Then, the polyimido film is heated and contact-bonded. The heating of the film adhesive 7 forces the resin component to flow so that the gap between the up-and-down polyimido film 4 may be filled with the resin. The resin is sealed after it is cooled, thereby producing a polyimido insulation layer 10. This manufacturing process is extremely easy and simple to handle, which makes it possible to enhance throughput and reduce manufacture cost dramatically. |
