发明名称 INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To form an interconnection by effectively utilizing a substrate face and to realize an integrated circuit which can be operated at ultrahigh speed by a method wherein a signal line is united to a power-supply line to constitute a transmission line. CONSTITUTION:DC power-supply lines 111, 112 by metals of two layers are laminated and formed on a substrate 1 by sandwiching a dielectric layer 12. A signal line 14 by a third-layer metal is arranged and installed on an alternating ground line 11. The signal line 14 has a structure in which it is separated from the alternating ground line 11 by a space 13 which is set at a prescribed height H. The alternating ground line 11 at the substratum is removed in bridge pier parts 15; the signal line 14 is supported by the dielectric layer 12 in removed parts 16, and the bridge pier parts 15 are constituted. The signal line 14 is arranged and installed so as to be united to the alternating ground line 11 in this manner, and is constituted as a transmission line having a desired propagation characteristic. Consequently, the reflection and the delay of a signal are controlled at a circuit unit connected by the signal line 14 or between circuit elements, and a circuit can be operated at ultrahigh speed.
申请公布号 JPH0462955(A) 申请公布日期 1992.02.27
申请号 JP19900172705 申请日期 1990.07.02
申请人 TOSHIBA CORP 发明人 KONNO YOSHIO
分类号 H01L21/768;H01L23/522;H01L23/528;H01L23/538 主分类号 H01L21/768
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