| 摘要 |
PURPOSE:To execute a high-speed operation by a method wherein a sealing glass is provided on a ceramic substrate via an electrode in a mesh-shaped pattern. CONSTITUTION:A mesh-shaped electrode 2 is formed on a ceramic substrate 1 by using a mesh-shaped pattern plate. Then, the upper part of the mesh-shaped electrode 2 and the outer circumferential part of the ceramic substrate 1 are coated, by using a screen-printing method or the like, with a sealing glass paste to be used as a sealing glass 3. The paste is heated; a ceramic substrate 9 is formed. On the other hand, the outer circumferential part of a ceramic lid 5 is coated, by using a screen-printing method or the like, with a sealing glass paste to be used as a sealing glass 3 used to airtightly seal a semiconductor element 6; and the paste is heated and formed. Then, the semiconductor-element mounting face of the ceramic substrate 9 is coated with a diapositive touch material 7; the semiconductor element is mounted on the material; the semiconductor element 6 and the lead frame 4 are connected by using wires 8; and after that, the ceramic lid 5 provided with the sealing glass 3 is mounted on a prescribed position; this assembly is heated; the semiconductor element is sealed airtightly. |
