| 摘要 |
The semiconductor devices (1) are soldered on an electrically insulating substrate (2) which is provided with conductor tracks (3). On the contact on the upper surface springs (4) are soldered, as well as on the underside (13).These make electrical contact with Au-plated Ci-contact areas (10) on the printed circuit board (PCB) (12). Electrical bias and signals are provided via those cntacts. The substrate is further provided with a housing (5) on hich a heatsink (6) has been attached. The assembly is placed inside a hole made in the PCB and is held in place by clips (7) hich fit under clamps (11) fitted on the PCB suface. The clips and clamps have correspondng contacting parts (8,14). The clip (7) is a spring made of metal, pref. BeC, or plastic. the clamps are pref. made of phosphorus-bronze. The springs (4,13) are pref. BeCu and are Au-plated in the areas where contact is made. |
