| 摘要 |
<p>PURPOSE:To realize a small size and a low cost by a method wherein a second semiconductor chip and its electrode are connected, by using a solder, to an electrode pad, for connection use, of a first semiconductor chip so as to correspond to it and this assembly is packaged by a resin. CONSTITUTION:Electrode pads 3a and 3b of a multilayer structure by chromium (lower layer)/copper (upper layer) or a titanium tungsten alloy (lower layer)/ copper (upper layer) are formed on the surface of a chip 3 or on its protective film. A solder bump 7a is formed of a multilayer-strcuture metal film by chromium (lower layer)/copper/gold (upper layer) or the like which can obtain a good electric connection in a position corresponding to the electrode pad 3a, for connection use, of the first semiconductor chip 3 also on the surface of a second semiconductor chip 4. A chip component 5 is a resistance or the like; and the surface of an electrode 5a is formed of a tin layer, a solder layer or the like. The pads 3a, 3b formed on the surface of the chip 3 are connected with respective solder bumps 7a and 7b. A pad 4a of the chip 4 and the electrode pad 5a of the component 5 are arranged so as to correspond. The whole assembly is heated, and the bumps 7a, 7b are made to reflow and are connected to the respective pads 4a, 5a.</p> |
