| 摘要 |
PURPOSE:To keep the independence of a chip at a central section and a chip at an end section constant, and to operate each chip uniformly by successively making the loop angles of bonding small-gage wires connecting a semiconductor element and a MOS-capacitor for an internal matching circuit differ toward the small-gage wires existing on the outside from the small-gage wires existing on the inside. CONSTITUTION:When end sections are mismatched because the reactance of output side circuit at the end sections is made smaller than the central sections of each transistor chip 1, the junction temperature of the cell-A of the transistor chip 1 is made higher than other cells by approximately 20 deg.C. The loop angles thetaof Au wires 3b, 3c are increased successively so as to compensate extremely small reactance in cells at the end sections by Au wires 3 in the transistor chip 1. Consequently, the decrease of reactance to the cell A is eliminated, a matched state is brought, and the junction temperature is lowered, and reaches a temperature in the same extent as other cells. Accordingly, each cell of a transistor is operated uniformly, and an output from the transister is increased while an MTTF is also improved. |
