| 摘要 |
PURPOSE:To improve mechanical strength of package leads by press-bonding insulating films from both surface of a lead frame by a mechanical press, and burying a gap between adjacent leads formed at the frame with the film. CONSTITUTION:An IC chip 1 and bonding wires 4 are protected with epoxy or silicone resin 7, and insulating films 8a, 8b are adhered from the front and rear surfaces of a lead frame to the resin 7. As the film, long Teflon film having 150mum of thickness and 2.0-2.5 of specific permittivity is used, and the specific permittivity of the films 8a, 8b is set to smaller than that of sealing resin. The width of the film 8a is 50mm, and the width of the film 8b is 35mm. The films 8a, 8b are adhesively intruded in the gap of package leads 3 by mechanically pressing the outside of the resin 7. |
