| 摘要 |
<p>PURPOSE:To enhance a yield and to form high-density wiring by a method wherein a protrusion part having a gentle slope is formed in advance on a substrate. CONSTITUTION:A partial glaze 22 as a protrusion part having a gentle slope is formed on a ceramic substrate 21. Then, a conductor pattern 23 is formed on the ceramic substrate 21 by a sputtering method, a vapor deposition method, a printing and backing operation or the like; and an insulating film 24 by a solder resist or the like is formed on the conductor pattern 23. Then, an IC chip 25 on which solder bumps 26 are formed is mounted on the ceramic substrate 21. Thereby, the IC chip 25 on which the solder bumps 26 are formed can surely be mounted on the ceramic substrate 21 on which the partial glaze 22 prescribing an interval is formed.</p> |
