| 摘要 |
PURPOSE:To increase stress resistance and joint strength by using an indium electrode and conductive paste for a joining section in the joining of a substrate and a chip part. CONSTITUTION:A wiring layer 12 is formed onto a glass substrate 11. On the other hand, chip electrodes 14 composed of aluminum are formed on the surface of an IC chip 13 joined with the glass substrate 11 in a projecting shape, and metallic thin-film layers 15 are formed so as to coat the surfaces of the chip electrodes. When projections are grown on the thin-film layers 15, Au electrodes 16 consisting of Au are superposed and formed, and In electrodes 17 using an indium alloy are shaped. Ag paste 18 employing silver is arranged among the In electrodes 17 and the wiring layers 12 on the glass substrate as conductive paste, and Ag paste 18 and the wiring layers 12 are joined, thus manufacturing an electronic part, with which the IC chip is cemented. Accordingly, adaptability and joint strength to stress in the joining of the wiring layers of the substrate and a chip part can be improved in the electronic part. |
