| 摘要 |
A probing test device is provided for contacting a plurality of probes with pads on a semiconductor wafer to be tested and supplying a test signal to a tester comprising a CPU for previously storing, as a reference image, the image signal obtained when the probes are correctly contacted with the electrode pads. The probing test device includes a mechanism for positioning these probes to be contacted with the pads on the wafer by moving the tested wafer relative to the probes, an optical system for image sensing those portions at which the probes are contacted with the pads, and a mechanism for positioning the optical system near to the pads by moving the optical system relative to the wafer. The CPU performs a comparison of the reference image signal with that image signal sensed for those portions at which the probes are contacted with the pads. which is picked up by the optical system to confirm whether or not both of these images coincide with each other, wherein the wafer is moved relative to the probes by the wafer positioning mechanism responsive to the result confirmed by the CPU.
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