| 摘要 |
<p>PURPOSE:To surely connect conductive plates with a lead frame with high accuracy by laminating and firmly sticking the conductive plates respectively composed at least of one copper foil to the lead frame main body with an insulating layer in between and connecting the plates to at least one lead of the lead frame main body with a conductive bonding agent. CONSTITUTION:Conductive plates 4 respectively composed at least of one copper foil are laminated and firmly stuck to a lead frame main body 5 with an insulating film 11 in between and the copper foil is connected to at least one lead of the main body 5 with a conductive resin. Since the conductive plates 4 respectively composed of the copper foil are connected to at least one lead of the lead frame main body 5 with the conductive resin, this semiconductor device become flexible and is increased in mechanical strength. Therefore, the plates 4 can surely be connected and, at the same time, the inductance can be reduced.</p> |
