| 摘要 |
<p>PURPOSE:To reduce the width of an integrated circuit device so as to reduce the occupied area of the device by mounting such electric circuit elements as a semiconductor element, chip parts, etc., on the circuit device by utilizing an outer lead section. CONSTITUTION:The outer lead section 2 of the title integrated circuit device is formed to have a wiring pattern-like shape and electric circuit elements, such as semiconductor elements, a chip component, etc., are mounted on the section 2 and are airtightly sealed after they are electrically connected. Therefore, a highly miniaturized integrated circuit device which has a narrow width, reduced occupied area, and simple constitution and does not require any connecting space can be realized at a low cost since the electric circuit elements, such as the semiconductor element 6, chip component 9, etc., can be mounted on the outer lead section 2.</p> |
