| 摘要 |
<p>PURPOSE:To prevent a cutter from being clogged by a method wherein a relief which has exposed the face of a semiconductor wafer is formed so as to correspond to a dicing line in a solder layer formed on the rear of the wafer and the wafer is cut along the relief by using the cutter. CONSTITUTION:Relieves 4a which have exposed the face of a semiconductor wafer 6 are formed so as to correspond to dicing lines by a cutter 1 in a solder layer 4 formed on the rear of the wafer. Then, the rear of the semiconductor wafer 6 is pasted on a tape 5. The semiconductor wafer 6 is cut along the dicing lines corresponding to the relieves 4a from the surface side of the semiconductor wafer 6 by using the cutter 1; and a wafer-shaped semiconductor device is separated into chip-shaped semiconductor devices 3. Thereby, the solder layer 4 does not adhere to the tip of the cutter 1, and it is possible to prevent the cutter 1 from being clogged.</p> |
