发明名称 |
Method of assembling a connector to a circuit element and soldering lead frame for use therein |
摘要 |
A connector (10) having one or more arrays of elongate cantilever beam arms (22) of contacts (20) can have contact sections (26) on free ends (24) thereof soldered to respective traces (94) of a circuit element (90), by securing a lead frame (50) to free ends (24) which includes a corresponding plurality of fingers (56) extending from a carrier strip (52). On the finger ends (58) are affixed preforms (80,82) of solder; on the carrier strip (52) is defined a thin magnetic layer, transforming the brass carrier strip into a Curie point heater. When the carrier strip is subjected to RF current, it generates thermal energy which melts the solder preforms to join the fingers first to the contact sections (26) of the connector contacts (20), and in a remote location later subjected to RF current to reflow solder preform (82) to join contact sections (26) to traces (94).
|
申请公布号 |
US5090116(A) |
申请公布日期 |
1992.02.25 |
申请号 |
US19900631819 |
申请日期 |
1990.12.21 |
申请人 |
AMP INCORPORATED |
发明人 |
HENSCHEN, HOMER E.;MCKEE, MICHAEL J.;PAWLIKOWSKI, JOSEPH M.;SCHAEFFER, RICHARD L.;SHAFFER, DAVID T.;SHARPE, ALEXANDER M. |
分类号 |
B23K3/047;H01R43/02;H01R43/16;H05K1/02;H05K3/34 |
主分类号 |
B23K3/047 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|