| 摘要 |
PURPOSE:To fix all inner leads securely and uniformly by adding a nonmetallic material with elasticity and heat resistance to the interface between the frame cap that fixes the inner leads in place and the inner leads. CONSTITUTION:An inner lead 2 is held in place by a frame cap 3 and bonding pads 5 on a semiconductor chip 4 are wire bonded to the inner lead' 2 by thin metal wires 6. Even in cases when there is inconsistency in the height of the inter leads 2 or when the frame cap 3 is slanted in one direction or deformed, the inner leads 2 are held securely in place by the frame cap 3 through a flexible and heat-resistant non-metallic material 9. |
